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Microelectronics International

An International Journal

ISSN: 1356-5362
Ranked by Thomson Reuters (ISI)
Full text online
Content: Table of Contents  |  Latest Issue RSS 
Information: Journal information  |  Editorial Team  |  Author Guidelines
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Information Page

Editorial objectives

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.

Topicality

State-of-the-art, in-depth technical papers and editorials are complimented by international industry trends, society news, new products and a diary of international events.

Key benefits

The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.

Key journal audiences

Microelectronics International represents a comprehensive and authoritative information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within industry and researchers and academics within universities.

Scope/Coverage

Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturised electronic devices and advanced packages. Among the broad range of topics covered are:

• advanced packaging 
• ball grid array (BGA) 
• ceramics 
• chip attachment 
• chip on board (COB) 
• chip scale packaging (CSP)  
• dieing 
• land grid array (LGA) 
• micro-circuit technology
• multichip modules (MCMs)
• scribing 
• semiconductor technology 
• thick/thin film technology

Indexing and abstracting services

Microelectronics International is indexed and abstracted in leading service providers, including:

• CSA Technology Research Database   
• CSA Engineering Research Database
• CSA High Technology Research Database with Aerospace
• CSA Materials Research Database with METADEX
• Inspec  
• ProQuest Science Journals
• Recent Advances in Manufacturing Database (RAM)
• Referativnyi Zhurnal 
• Scopus
• Thomson Scientific
• Science Citation Index Expanded (SciSearch®)
• Journal Citation Reports/Science Edition
• Current Contents® /Engineering, Computing, and Technology
• Materials Science Citation Index® 
• Zetoc Electronic Table of Contents

Microelectronics International is available as part of an online subscription to the Emerald Electronics Manufacture and Packaging Subject Collection. For more information, please email collections@emeraldinsight.com.

This journal is a member of and subscribes to the
principles of the Committee on Publication Ethics.