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Soldering & Surface Mount Technology

ISSN: 0954-0911
Ranked by Thomson Reuters (ISI)
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Information Page

Editorial objectives

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area.

Topicality

The journal provides state of the art, technical papers and editorials by leading industry experts, complemented by reports, international industry trends, society news, new products and international diary of events.

Soldering & Surface Mount Technology compliments its sister publications, Circuit World and Microelectronics International.

Key benefits

Soldering & Surface Mount Technology is a unique, authoritative, international and multi-disciplinary periodical for those with a research and application interest in all branches of soldering and surface mount technologies. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. All submissions are subject to double-blind peer review.

Key journal audiences

Soldering & Surface Mount Technology represents a comprehensive and independent information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within the electronics assembly industry, contract manufacturers, ordinary equipment manufacturers (OEMs) and users together with all academic branches of engineering and science together with their information providers, namely academic, institutional, technical and corporate libraries.

Scope/Coverage:

The journal comprises a multidisciplinary study of the key technologies relating to the assembly of printed circuit boards (PCBs) and the interconnection of electronic components and other devices on the printed board. Among the broad range of topics covered are:

• surface mount technology (SMT)
• surface mount assembly
• soldering
• solders, pastes and fluxes
• screen printing and liquid deposition
• conductive adhesives
• conformal coatings
• inspection and test
• packaging and interconnection
• quality control
• rework and repair
• encapsulants
• cleaning
• environmental aspects

Indexing and abstracting services

Soldering & Surface Mount Technology is indexed and abstracted in leading service providers, including:

• CSA Technology Research Database  
• CSA Engineering Research Database
• CSA High Technology Research Database with Aerospace
• CSA Materials Research Database with METADEX- Inspec
• Proquest Science Journals
• Recent Advances in Manufacturing Database (RAM)
• Referativnyi Zhurnal
• Scopus
• Thomson Scientific
• Science Citation Index Expanded (SciSearch®)
• Journal Citation Reports/Science Edition
• Current Contents® /Engineering, Computing, and Technology
• Materials Science Citation Index®
• Zetoc Electronic Table of Contents

Soldering & Surface Mount Technology is available as part of an online subscription to the Emerald Electronics Manufacture and Packaging Subject Collection. For more information, please email collections@emeraldinsight.com.

This journal is a member of and subscribes to the
principles of the Committee on Publication Ethics.