Editorial team
Editor
Professor Martin Goosey
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough, LE11 3TU, UK
m.goosey@lboro.ac.uk
Associate Editor
John Ling,
Consultant,
UKPublisher
Harry Colson
hcolson@emeraldinsight.com
Assistant Publisher
Gemma Halder
ghalder@emeraldinsight.com
Editorial Advisory Board
Dag Andersson,
Swerea IVF AB,
SwedenFrank Bai,
TPCA,
Taiwan (Republic of China)Paul Barlow,
AT&S,
People's Republic of ChinaMartin Bayes,
The Dow Chemical Company,
USABill Birch,
PWB Interconnect Solutions Inc.,
CanadaFrank Cala,
FR Cala Consulting, LLC,
USA Zhong Chen,
Nanyang Technological University,
SingaporeAndy Cobley,
The Sonochemistry Centre at Coventry University,
UKPaul Comer,
Graphic Plc,
UKMartin Cotton,
Sanmina - SCI,
GermanyWalt Custer,
Custer Consulting Group,
USAJohn Everett,
Dow Deutschland GmbH & Co OHG,
SwitzerlandJoseph Fjelstad,
Verdant Electronics,
USAFu Guo,
Beijing University of Technology,
People's Republic of ChinaHappy Holden,
Mentor Graphics - SDD,
USADavid Hutt,
Loughborough University,
UKRaymund Kwok,
Foxconn,
Hong KongAlun Morgan,
Isola Werke UK Ltd,
UKNeil Patton,
Atotech Deutschland GmbH,
GermanyTarja Rapala-Virtanan,
Meadville Group,
People's Republic of ChinaBahgat Sammakia,
Binghamton University,
USAPete Starkey,
Institute of Circuit Technology,
UKFrancesca Stern,
BPA Consulting,
UKGitachari Sudarsanam,
Fine Line Circuits Ltd,
IndiaJohn Walker,
Institute of Circuit Technology,
UKMichael Weinhold,
European Institute of Printed Circuits,
Netherlands