Electronics Manufacture Articles
Our index of selected Electronics Manufacture articles
A complementary collection of innovative technical journals providing access to both theoretical and practical intelligence, the Electronics Manufacture and Packaging article index ensures you have easy access to all the key issues in this field.
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From: Soldering & Surface Mount Technology, volume: 21 issue: 3 pp39-46, 2009
Little interest has been shown in pickup conditions and parameters and their effect on placement accuracy in the literature before. The purpose of this paper is to find out the possible link between pickup conditions and placement accuracy of typical discrete chip components.
From: Soldering & Surface Mount Technology, volume: 21 issue: 3 pp30-38, 2009
The wafer level package (WLP) is a cost-effective solution for electronic packaging and has been increasingly applied in recent years. The purpose of this paper is to propose a newly developed packaging technology, based on the concepts of the WLP, the panel base package technology, in order to further obtain the capability of signal fan-out for fine-pitched integrated circuits.
From: Microelectronics International, volume: 26 issue: 3 pp9-21, 2009
The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit. The device is very suitable for wearable applications in which small size and light weight are required, such as body area network, medical, sports and entertainment applications.
From: Circuit World, volume: 35 issue: 3 pp8-11, 2009
The purpose of the paper is to present an update and the latest results from work on a project which could be useful for maskless printed circuit board manufacturing. The paper presents a fundamentally different approach to transfer micron scale pattern using a maskless technology. The platform technology involves using a mask to pattern each substrate; this work shows that micron scale patterns can be transferred without masking by optimizing electrochemical reactor technology.
From: Circuit World, volume: 35 issue: 1 pp22-29, 2009
Stretchable circuits have recently gained interest due to their numerous applications, including implantable biomedical devices, textile or wearable electronics, or in general applications where the ability to deform is an advantage to improve the comfort of consumers' needs. This technology integrates different electronic components into a compliant polymer substrate that may be stretched once or many times depending on the application. The reliability of these electronic circuits is still one of the main questions concerning this relatively new technology. This paper presents an update on the progress of the design and reliability of stretchable interconnections for electronic circuits.
From: Microelectronics International, volume: 26 issue: 1 pp22-32, 2009
The aim of this work is to examine the Hopfield network for the field programmable gate array (FPGA) cell placement. FPGA circuits are commonly used in many fields of electronics, telecommunications, robotics, astronomy and medicine. Some FPGA reconfigurable circuits support run-time reconfiguration. FPGA circuits are becoming faster than traditional microprocessors because they do not need to read instruction codes written in a memory. Implementation of an algorithm written in VHDL or Verilog in FPGA circuits requires synthesis, placement and the routing of logic cells. Unfortunately, FPGA circuits lose much of their value if the presented design flow requires a long time to complete. This paper presents the authors' research work on hardware implementation of the placement and routing of logic cells in order to accelerate those stages.
From: Microelectronics International, volume: 26 issue: 1 pp10-16, 2009
This paper attempts to provide an introduction to recent developments and the trends in wire bonding using copper wire by reviewing dozens of recently published journal and conference articles. With the references provided, readers may explore the issues more deeply by reading the original documents.
From: Soldering & Surface Mount Technology, volume: 21 issue: 1 pp4-10, 2009
Interconnection technology for joining metallic pads of flexible printed circuit boards (FPCB) to the outer leads of modules, displays, rigid printed circuit boards (RPCB) and similar components is of increasing importance in the electronics industry. The FPCB is light, thin and flexible and can be applicable to various electronic products. Currently, a widely used method for the interconnection of FPCB is adhesive bonding using an anisotropic conductive film (ACF). The ACF or anisotropic conductive adhesives are useful for applications which require fine pitch bonding and thin packages such as chip-on-glass, chip-on-film, PCBs, LCD assembly and flip-chip packaging. However, the ACF is expensive and shows low electrical conductivity due to the mixture of conducting metal and non-conducting polymer resin. The ACF also needs higher temperature and pressure for bonding. Meanwhile, ultrasonic bonding has advantages of short bonding time, low bonding temperature and pressure, low cost and better electrical conductivity. The aim of this paper is to study the feasibility of direct ultrasonic bonding between contact pad arrays on FPCBs and RPCBs at ambient temperature.
From: Circuit World, volume: 35 issue: 1 pp34-40, 2009
Developments in sensor technology and wireless communication have enabled a promising future in the fields of medical and sports applications. The use of remote control has also been a growing area of interest in agricultural systems, such as in animal livestock control. Typical medical applications for sensors include, among others, blood pressure, motion, pulse, impedance and temperature monitoring. In health-care applications, remote patient monitoring increases security for the patient, as she/he then is not in physical contact with high power equipment. Many long-term implantable medical devices have already been tested and are on the market. At present, the majority of these are battery-powered systems which receive their power from primary or rechargeable batteries. For long-term implantation, however, the primary battery is not very suitable as replacing it with a new one requires a surgical operation, which is naturally a burden to a patient. Batteries also have a tendency to self-discharge. This paper investigates alternative power sources for implantable applications.
From: Circuit World, volume: 34 issue: 3 pp13-17, 2008
In August 2007, the European Institute of Printed Circuits produced a Technology Roadmap for the industry for the period 2007-2017. The purpose of this paper is to give details of the roadmap, the aim of which is to provide information which underpins the aims of the EU-funded ProSurf project, which are to strengthen European small-to-medium enterprises competitiveness in both the medium and long term through increasing knowledge and awareness of high-tech methods in these industries.